On September 19, according to foreign media reports, just after Apple officially released the iPhone 6 and iPhone 6 Plus, a disassembly and repair company and related blogs released disassembly reports on the two products, interpreting the design changes of their main components and the internal structure adjustments caused by the ultra-thin body. iPhone 6 In Japan, Apple blog Mac Otakara's teardown of the 4.7-inch iPhone 6 showed a sleek interior with all the new components crammed into a slightly modified frame. Judging from the teardown video, Apple was forced to make some compromises in order to design an ultra-thin body. For example, the 1810 mAh battery is now fixed to the aluminum chassis by adhesive, which is a big change between the removable batteries of old iPhones and the bonded power packs of current iPads . To fit into the 6.9mm-thick chassis, several components have been redesigned or tweaked, including the earpiece, vibrator, iSight camera module, and display, which now appears to be bonded to the panel glass. Looking at each component individually, they are obviously mostly consistent with previous component rumors, including logic boards, Touch ID, phone cables, etc. iPhone 6 Plus iFixit disassembled the 5.5-inch iPhone 6 Plus and confirmed the rumor that the phone uses a 2915 mAh battery (voltage is 3.82V, 11.1Wh), which is almost twice the capacity of the iPhone 5s. Like the 4.7-inch iPhone 6, the iPhone 6 Plus also changes the location and design of the vibrator, which is now located to the right of the battery. Apple appears to be using a linear vibrator instead of the rotary vibrator used in the iPhone 5s. Unlike the linear vibrator of the iPhone 4S, the iPhone 6 Plus's is rectangular. On the logic board, Apple's new A8 system-on-chip is clearly visible, just above the iPhone's nano-SIM card reader; the Hynix NAND flash memory module is on the other side. Other major components include: Qualcomm's MDM9625M LTE-Advanced modem (supporting carrier aggregation), Murata's WiFi module, Broadcom's touchscreen controller, two baseband chips from Avago, and chips from Triquint and Skyworks. The new generation of iPhones is the first product to include NFC (near field communication) chips, which are used to support Apple's new Apple Pay mobile payment platform. The NFC chip in the iPhone 6 Plus comes from NXP Semiconductors. NXP also provides the phone with a motion co-processor, a component designed to support the operation of sensors without consuming power. As a winner of Toutiao's Qingyun Plan and Baijiahao's Bai+ Plan, the 2019 Baidu Digital Author of the Year, the Baijiahao's Most Popular Author in the Technology Field, the 2019 Sogou Technology and Culture Author, and the 2021 Baijiahao Quarterly Influential Creator, he has won many awards, including the 2013 Sohu Best Industry Media Person, the 2015 China New Media Entrepreneurship Competition Beijing Third Place, the 2015 Guangmang Experience Award, the 2015 China New Media Entrepreneurship Competition Finals Third Place, and the 2018 Baidu Dynamic Annual Powerful Celebrity. |
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