Skylake processors are more likely to be bent? Intel says it's not our fault

The news that the radiator may damage the Skylake processor broke out two weeks ago caused many players to worry. Now Intel has also expressed its position on this issue, stating that the thermal design specifications of the LGA1151 processor have not changed, and the document has been released to manufacturers. They do not comment on the design of third-party radiator manufacturers.

Since the PCB of Skylake processors has become 1/3 thinner, the news that the heat sink may damage Skylake processors broke out two weeks ago has caused many players to worry. In fact, there have been cases of heat sinks being bent. Heat sink manufacturers have different solutions to this problem. Very few manufacturers are willing to replace the clips for users, and most insist that their own heat sinks are fine. Now Intel has also expressed its position on this issue, saying that the thermal design specifications of the LGA1151 processor have not changed, and the documents have been released to manufacturers. They do not comment on the designs of third-party heat sink manufacturers.

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The reason why the Skylake processor may be damaged is that the PCB of the Skylake processor has become thinner, from 1.17 mm of the Haswell processor to 0.78 mm, which is reduced by almost 1/3. In theory, this will cause the pressure-bearing capacity of the Skylake processor to decrease. Once the external pressure is too great, the CPU may be damaged.

In addition, a radiator manufacturer mentioned in an announcement that Intel did not publish the thermal design specification document for the Skylake processor, so many radiators were designed according to the previous LGA1150 socket processor. These statements have brought the conflict point to Intel.

Intel has to speak out about these questions, otherwise they will be blamed. In an official statement, Intel pointed out that the design specifications and guidelines of the sixth-generation intelligent processors have not changed compared to the previous generation of processors, and have been announced to partners and third-party heat sink manufacturers. Intel said that they will not comment on the designs of third-party heat sink manufacturers or their loyalty to the recommended design specifications (meaning that Intel will not care whether third-party manufacturers actually follow their design specifications). For questions about specific cooling products, Intel will respect the manufacturer.